报告人：Prof. Dongyan Xu

The Chinese University of Hong Kong

邀请人：王洪超 博士

报告时间：2018-06-25 上午 9:00

报告地点：知新楼C座1111报告厅

报告内容: Nanostructured materials have attracted tremendous research interest due to their unique thermal, electrical, and mechanical properties and their potential applications in various energy devices. In this talk, I will share some of our recent research effort on understanding thermal transport in nanostructured materials by using two experimental techniques. First, I will introduce my previous work on characterizing thermal conductivity of p-type InGaSb thermoelectric thin films by a differential three omega method. Then, I will talk about our recent work on probing the phonon mean free path in the c-axis of graphite by using the same method. Until very recently, it has been commonly believed that phonon mean free path in the c-axis of graphite is very short, only a few nanometers at room temperature.  However, our experiments show that the c-axis phonon mean free path of graphite could be as long as 200 nm at 300 K, much longer than the commonly believed value. In the second part, I will introduce our work on thermoelectric transport in individual bismuth selenide nanoribbons by using a suspended thermal bridge method. This technique can be used to determine thermal and electrical properties of individual nanowires/nanotubes/nanoribbons as well as in-plane thermal conductivity of thin films.

报告人简介：Prof. Dongyan Xu is currently an Associate Professor in the Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong. Prof. Xu received her Bachelor, Master, and Ph.D. degrees from Tsinghua University and Vanderbilt University. After that, she worked as a Postdoc in the University of California, Berkeley and Lawrence Berkeley National Laboratory for two years. She joined CUHK in 2010 as an Assistant Professor and was promoted to Associate Professor in 2016. Her current research interests include nanoscale heat transfer, thermoelectric materials and devices, thermal management, and boiling heat transfer.